Embedded Technologies Expo & Conference
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Tuesday, June 28 • 2:55pm - 3:25pm
New Interfaces for Low Density FPGAs Enable New Edge and IoT Use Cases

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Small form factor, low power FPGAs are now adopting new interfaces including Bluetooth Low Energy, USB and MIPI C-PHY allowing for a variety of unique localized processing and data transfer use cases. Benefits and tradeoffs of using an FPGA over alternative silicon devices will be shared as well as discovery of use cases that are only now possible as a result of these new interfaces being available. SoC's with FPGA fabric, MCU and BLE now provide highly flexible sensor hub and ML processing capabilities for remote edge processing and result transmission USB interfacing on FPGAs now provide flexible interfacing for devices, hosts and hubs that could previously only be developed with ASICs. MIPI C-PHY interfaces on new FPGAs provide higher resolution, frame rate and lower power display options for displaying remote data on automotive and IoT devices.

avatar for Grant Jennings

Grant Jennings

Senior Director of International Marketing, Gowin Semiconductor
Grant Jennings is Sr. Director of International Marketing at GOWIN Semiconductor focused on strategic solutions for programmable technologies. He has over 15 years of FPGA systems architecture and solution development experience in areas including ASIC prototyping, interfacing, bridging... Read More →

Tuesday June 28, 2022 2:55pm - 3:25pm PDT
Room 211A